Short form of Ball Grid Array – it is a mounting technology in which the CHIPS is attached to the Circuit Board in Grid pattern, the “Solder Ball /Foot” is often used for the packaging. BGA is similar to PGA packaging (Pins Grid Array), but using Solder Balls instead of metal pins to allow more contact points between the Chips and the circuit board.
BGA advantages are: High density; better thermal and electrical performance by better heat flow and lower inductance. Disadvantages are: not flexible under mechanical stress and expensive inspection and repair cost.
